Research

High-performance ceramic substrates for semiconductor applications

(반도체용 고인성/고열전도/고저항 세라믹 방열기판 개발 연구)

We try to develop highly thermally conductive nitride-based ceramics including AlN and Si3N4 for next-generation power semiconductor substrates.
By employing hot-press sintering technique, we design advanced nitride composites that combine superb fracture toughness with excellent thermal conductivity.
We also engineer point-defect chemistry and optimize densification profile of the nitride materials to achieve high volumetric resistivity at wafer-processing temperatures for advanced electrostatic chuck application in semiconductor manufacturing.

(마이크로 및 나노 스케일에서 세라믹스 소재의 기계적 물성 연구)

Micro and nanomechanics study fundamental mechanical property of physical systems at small scales.

Through microindentation and scratch tests, hardness, scratch resistance, elastic modulus, and indentation size effects can be studied from micron to nanometer scales across oxide and non-oxide ceramics.
We can understand the underlying deformation mechanisms through the real-time observation of deformation behaviors via in-situ SEM microcompression tests.

Flash sintering is one of the field-assisted sintering techniques that can considerably reduce sintering temperature and time.
Flash sintering can introduce unique defects in ceramic and composite materials which are rare to observe in conventionally sintered materials.
Ultrafast high-temperature sintering utilizes high electric currents that induce radiative heating to enable ultrafast densification while tailoring materials’ microstructures.
We also study multiphysics finite element modeling to capture the coupled electric, thermal, structural interactions in nanoceramics allowing to predict temperature evolution and densification kinetics for efficient process design.

Recycling of Si scrap achieves both environmental and economic value by turning industrial waste into advanced SiC-based ceramics and composites for next-generation aerospace, nuclear and semiconductor technologies.
Traditional consolidation method such as hot-press sintering fabricates SiC with high-density and excellent mechanical properties, while also maintaining stable thermal conductivity for reliable high-performance components.
Our group also explores flash sintering and ultrafast high-temperature sintering as energy-efficient approaches to achieve high-density SiC ceramics and composites.

Additive manufacturing technologies (also known as 3D printing) construct parts with very complex shapes in three dimensions in a discrete layer-by-layer manner.
Direct ink writing (DIW) is one of the most successful additive manufacturing technologies for ceramics in which ceramic-bearing semi-liquid paste is extruded from a small nozzle while the nozzle is moving across the platform.
Digital light processing (DLP) is a lithography-based 3D printing technique. An integral image is transferred by exposing the light source through a patterned mask to the photopolymerizable liquid with nanoceramic powders.

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